VoxelMind is autonomous CT inspection for semiconductor packaging. AI that reads 3D scans and catches what human eyes miss, at production speed.
Skilled engineers spend hours reviewing CT scans slice by slice. As packaging density increases, inspection time grows exponentially while talent stays scarce.
ZEISS, Nikon, and Waygate build world-class CT hardware. Their analysis software is an afterthought. Bolted-on, manual, and slow.
Optical and X-ray 2D inspection catches surface defects. Hidden voids, internal cracks, and subsurface delamination require 3D CT analysis.
Analyzes full 3D CT volumes automatically. Identifies voids, cracks, solder bridging, delamination, and wire bond failures without human intervention. Reports confidence scores and defect coordinates.
Works with CT data from any scanner. ZEISS, Nikon, YXLON, Waygate. Upload DICOM, TIFF stacks, or raw voxel data. No vendor lock-in.
Tracks defect patterns over time. Correlates failures with process parameters. Predicts quality issues before they cascade through your production line.
Built by packaging engineers, not generic computer vision. Understands BGA, QFN, flip-chip, PoP, SiP architectures. Knows what a real defect looks like versus acceptable variation.
VoxelMind is building the inspection layer for the next generation of chip manufacturing.